Innovation and R&D
Innovation and R&D
A strong technical team and R&D capabilities are committed to innovation in the field of micro nano thin films and chip level packaging.
Continuously invest in research and development, and continuously launch competitive products and solutions.
At the leading technological level in the industry, we provide customers with advanced and reliable thin film ceramic substrates and solutions.
Customized Services
Customized Services and Flexible Production
Provide one-stop services for thin film circuit design, including graphic customization processing, thin film product design support, etc.
Flexible production capacity can meet the customization needs of customers for large quantities of orders.
Provide customized solutions based on specific customer requirements to ensure that the product meets the specific application requirements of the customer.
Strict Quality Management
Strict Quality Management System
By obtaining ISO9001 and ISO14001 certifications, we ensure that our product quality meets international standards.
Complete testing and evaluation capabilities, including comprehensive testing of product appearance, feature dimensions, electrical testing, film thickness, wire bonding, welding and shearing, etc.
Provide high-quality and reliable products to win customer trust.
Professional application ability
Applications in LD, Optical-com & LiDAR
Has rich experience and professional knowledge in the fields of optical communication, LiDAR, LD Submount, etc.
We provide professional design and manufacturing services for optical communication packaging substrates, LD Submount, and other fields to meet the needs of different applications.。